Connect the Future, Smart Manufacturing Ecosystem and Global Opportunities

October 28-30, 2025, Shenzhen, China

Serving as Asia’s premier platform for electronics manufacturing innovation, NEPCON ASIA 2025 will take place from October 28 to 30 at the Shenzhen World Exhibition & Convention Center (Bao’an). The event will feature over 600 leading exhibitors showcasing hundreds of new products and solutions in SMT, testing and measurement, soldering, dispensing, semiconductor packaging, and automation.

Key themed areas debuting this year include AI Smart Glasses Disassembly, Flexible Manufacturing and Intelligent Transport Systems, Low-Altitude Flight Components Disassembly, Embodied Intelligence Robot Core Parts, Electronic Finished Products Automated Packaging, and IGBT & SiC Packaging and Testing Demo Line. With more than 2,000 buyers expected from emerging fields such as low-altitude flight, embodied robotics, and AI, NEPCON ASIA offers unparalleled opportunities for connection and growth.

The event also hosts 40 high-level conferences covering advanced manufacturing, semiconductors, power electronics, robotics, and AI, featuring experts from China, the US, Japan, and Thailand, providing forward-looking insights to empower industry growth.

Situated in Shenzhen, China’s technology and manufacturing hub, the show leverages a complete electronics ecosystem and unmatched supply chain advantages. Collaborations with overseas industry associations across Southeast Asia will support factory tours, business matchmaking, and networking salons, fostering deeper global integration.

Visitor pre-registration is now open—join NEPCON ASIA 2025 to explore new markets, capture emerging opportunities, and enhance your global competitiveness.

For More Details, Please Read: https://www.nepconasia.com/en-gb.html